JPH0415870U - - Google Patents
Info
- Publication number
- JPH0415870U JPH0415870U JP5672890U JP5672890U JPH0415870U JP H0415870 U JPH0415870 U JP H0415870U JP 5672890 U JP5672890 U JP 5672890U JP 5672890 U JP5672890 U JP 5672890U JP H0415870 U JPH0415870 U JP H0415870U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electrical component
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5672890U JPH0415870U (en]) | 1990-05-30 | 1990-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5672890U JPH0415870U (en]) | 1990-05-30 | 1990-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415870U true JPH0415870U (en]) | 1992-02-07 |
Family
ID=31580811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5672890U Pending JPH0415870U (en]) | 1990-05-30 | 1990-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415870U (en]) |
-
1990
- 1990-05-30 JP JP5672890U patent/JPH0415870U/ja active Pending